FT3207: Innovative Active Cooling IC for Uncompromised AI Performance

 As 5G+AI technology advances, smartphone chips get more powerful but use more power and run hotter. Many traditional passive cooling solutions fall short and continually fail the industry as they cause performance degradation, device aging, system lag or crash, etc. To address these challenges, Fortior (stock code: 688279) introduces FT3207, an innovative fully integrated chip to deliver superior cooling performance through the following key advancements:

Sensorless Sinewave Drive:

Reduce audible noise by 1.6dB compared with other solutions

Intelligent Temperature Control Algorithm:

Dynamically adjust cooling efficiency to ensure best performances

Full-scenario Coverage:

Control temperature across all scenarios – from high-intensity gaming sessions to sustained AI workloads

Cooling = Performance

FT3207 intelligently optimizes smartphone cooling systems to ensure stable performance for demanding applications like AI processing, real-time rendering, video editing, etc. It sets a new industry benchmark in thermal management for mobile devices and pioneers a next-generation thermal ecosystem by partnering with industry leaders.

Active Cooling: 6°C Surface Temperature Drop

Passive cooling relies on natural heat dissipation via the device’s chassis, while active cooling deploys an integrated fan to overcome physical limitations. A 30-minute Genshin Impact stress test shows that the phone with active cooling (Fan ON) reduces surface temperature by 6°C compared to the same device with passive cooling (Fan OFF).

Powerful Noise Reduction

FT3207 delivers a smoother sinusoidal waveform with a narrower sinusoidal window, achieving 5.01dB lower Total Noise Rating (TNR) at the same speed compared to other solutions.

Integrated and Compact Design

Real-time Response: Dynamically adapt cooling strategies by temperature sensor and AI algorithms – delivering peak cooling performance during intensive tasks like gaming, while maintaining near-silent operation in standby state.

 FT3207 Features and Parameters

1.     Support RD, FG, 1/3FG, 1/2FG or 2/3FG output

2.     Wider PWM input: 20Hz ~ 62.5kHz

3.     Speed curve in IDLE mode (PWM<10%: Motor runs with 10% duty cycle)

4.     Smaller sinusoidal window, smoother waveform and lower noise

5.     Short-circuit protection effectively protects the motor when short circuit occurs at any phase (U/V/W)

1.Operating Voltage: 2V ~ 6V

2.Operating Current: 800mA (TA = 85℃)

3.Output Signal: FG, 1/2FG, 1/3FG, 2/3FG or RD

4.PWM Input: 20Hz ~ 62.5kHz

5.ESD Rating: HBM 8KV; MM 800V

6.Package: DFN10 (3x3*0.5mm) or smaller (1.75*1.75*0.37mm)

Innovative IC Solution for Peak Performances

Active cooling solution enhances thermal management by optimizing heat input, achieving an optimal balance between heat dissipation and performance. This balance is primarily enabled by intelligent and high-efficiency driver chips that dynamically manage heat distribution. As smartphones demand higher performance, the active cooling technology is expected to expand from gaming phones to flagship models and eventually mid-tier smartphones.

 FT3207 redefines smartphone cooling by delivering unmatched performance and exceptional heat dissipation. Whether for extended gaming sessions or heavy AI workloads, it actively mitigates overheating to ensure smooth and lag-free operation. More than a cooling advancement, FT3207 marks a major leap in efficiency and user experience.