| Jobs | Category | Work place | Release Date | Operation |
|---|
| Quality Engineer | Technology | Shenzhen | 2026-07-28 | View Details |
Assist in incoming/process/outgoing inspection;
log quality data;
assist in 8D reporting;
learn SPC/FMEA;
maintain ISO docs;
track customer complaint corrections.
Majors: Electronics Packaging, EE, Automation, etc. Knowledge of quality tools (8D/SPC/FMEA) & ISO standards.
Bachelor’s degree or above
| NPI Engineer | Operation | Shenzhen | 2026-07-28 | View Details |
Assist in NPI trial runs;
track material/fixture readiness;
record process issues & yield data;
assist in DOE/CPK validation;
maintain NPI docs (BOM/ECN/Checklist).
Majors: Power Electronics, EE, CS, etc. Knowledge of NPI process & pilot run/process validation.
Bachelor’s degree or above
| ATE Test Engineer | Operation | Shenzhen | 2026-07-28 | View Details |
Assist in new product introduction (NPI) trial runs; track material/fixture readiness; record process yield data; assist in DOE/CPK validation; maintain NPI docs (BOM/ECN).
Majors: Power Electronics, EE, CS, etc. Knowledge of ATE platforms (Teradyne/Advantest) & mass production test flow.
Bachelor’s degree or above
| Planning Engineer | Operation | Shenzhen | 2026-07-28 | View Details |
Develop MPS & MRP based on forecasts;
coordinate procurement/production/logistics to meet delivery targets;
monitor ERP data accuracy;
drive inventory optimization;
participate in supply chain digitalization projects.
Majors: Power Electronics, EE, CS, etc. Knowledge of ERP systems & production planning.
Bachelor’s degree or above
| Overseas Technical Support Engineer | Technology | Shenzhen,Qingdao,Foshan,Hefei,Hangzhou,Overseas | 2026-07-28 | View Details |
Handle overseas technical inquiries;
prepare English technical docs;
assist in on-site overseas support;
gather local market requirements;
prepare training materials.
Majors: Instrumentation, EE, Automation, Power Electronics, etc. Fluent English, willing to travel overseas, customer-oriented.
Bachelor’s degree or above
| Hardware Test Engineer | Technology | Shenzhen | 2026-07-28 | View Details |
Perform electrical characteristic tests (power/ripple/timing);
use oscilloscopes/multimeters;
environmental reliability tests;
assist in SI testing;
write test reports.
Majors: Instrumentation, EE, Automation, Power Electronics, Communications, Mechanical, Motor, etc. Familiar with oscilloscopes, signal sources & signal integrity.
Bachelor’s degree or above
| Embedded Test Engineer | Technology | Shenzhen,Qingdao,Foshan,Hefei,Hangzhou | 2026-07-28 | View Details |
Execute functional, stress & compatibility tests;
build test environments;
write automation scripts (Python/Shell);
log bugs;
write test reports.
Majors: Instrumentation, EE, Automation, Power Electronics, Communications, Mechanical, Motor, etc. Knowledge of test theory & scripting.
Bachelor’s degree or above
| Hardware Engineer | Technology | Shenzhen,Qingdao,Foshan,Hefei,Hangzhou,Overseas | 2026-07-28 | View Details |
Customer product selection & technical support;
on-site debug support;
write FAQs & app notes;
collect customer feedback;
prepare training materials.
Majors: Instrumentation, EE, Automation, Power Electronics, Communications, Mechanical, Motor, etc. Knowledge of schematic/PCB tools (Altium/Cadence) & EMC.
Bachelor’s degree or above
| Application Engineer | Technology | Shenzhen,Qingdao,Foshan,Hefei,Hangzhou,Overseas | 2026-07-28 | View Details |
Customer product selection & technical support; on-site debug support; write FAQs & app notes; collect customer feedback; prepare training materials.
Majors: Instrumentation, EE, Automation, Power Electronics, Communications, Mechanical, Motor, etc. Good communication & field troubleshooting skills.
Bachelor’s degree or above
| Product Engineer | Technology | Shenzhen,Qingdao,Foshan,Hefei,Hangzhou,Overseas | 2026-07-28 | View Details |
Collect market/competitive info;
track new product development;
follow up on trial build issues (EVT/DVT);
manage BOM changes;
support mass production ramp.
Majors: Instrumentation, EE, Automation, Power Electronics, Communications, Mechanical, Motor, etc. Knowledge of product development & project management.
Bachelor’s degree or above
| Software Engineer | Technology | Shenzhen | 2026-07-28 | View Details |
Develop/debug drivers (UART/SPI/I2C/GPIO) on ARM/DSP;
develop app modules under Linux/RTOS;
write host tools (Python/C#/Qt);
code reviews & Git;
write docs.
Majors: CS, Software Eng. Proficient in C/C++/Python; experience with embedded Linux or RTOS.
Bachelor’s degree or above
| Sensor Application Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
Sensor selection & testing;
design signal conditioning circuits (amplifier/filter);
build test fixtures;
sensor calibration;
write app notes & test reports.
Majors: Instrumentation, EE, Automation, Power Electronics, etc. Knowledge of sensor principles & signal conditioning.
Bachelor’s degree or above
| Motor Control Algorithm Engineer | Technology | Shenzhen,Qingdao,Foshan,Hefei,Hangzhou,Overseas | 2026-07-28 | View Details |
Build motor control simulation models (FOC/DTC);
parameter tuning;
assist in motor bench testing;
port algorithms to embedded platforms;
write docs.
Majors: Control Theory, Power Electronics, Automation. Knowledge of FOC/DTC & MATLAB/Simulink.
Bachelor’s degree or above
| Packaging R&D Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
Assist in package structure design & material selection;
thermal/stress simulation;
trial production support;
reliability testing;
write design & test reports.
Majors: Microelectronics, Materials, IC Design, Mechatronics, etc. Knowledge of packaging processes & reliability standards.
Bachelor’s degree or above
| IPM R&D Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
Assist in IPM circuit design & simulation;
build test platforms;
perform electrical tests;
learn thermal/EMC basics;
write test reports & BOM.
Majors: IC, Electronics, Microelectronics, EE. Knowledge of power module circuit design & system debug.
Bachelor’s degree or above
| Layout Design Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
Layout drawing for analog/digital blocks;
run DRC/LVS/ERC checks;
assess parasitic effects;
participate in layout reviews;
prepare tape-out docs.
Majors: IC, Electronics, Microelectronics, EE. Knowledge of layout tools (Virtuoso/Laker) & DRC/LVS.
Bachelor’s degree or above
| IGBT Design Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
Build UVM verification env.;
write test cases;
run regressions & coverage analysis;
debug with VCS; maintain scripts;
write verification plans & reports.
Majors: IC, Electronics, Microelectronics, EE. Knowledge of SystemVerilog/UVM & VCS.
Bachelor’s degree or above
| Digital Verification Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
Build UVM verification env.;
write test cases;
run regressions & coverage analysis;
debug with VCS; maintain scripts;
write verification plans & reports.
Majors: IC, Electronics, Microelectronics, EE. Knowledge of SystemVerilog/UVM & VCS.
Bachelor’s degree or above
| Digital IC Design Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
RTL coding & simulation; synthesis,
STA & formal verification;
basic low-power design;
assist verification; write design docs.
Majors: IC, Electronics, Microelectronics, EE. Knowledge of Verilog/VHDL & tools (DC/PT/Formality).
Bachelor’s degree or above
| Analog IC Design Engineer | Technology | Shenzhen,Shanghai | 2026-07-28 | View Details |
Circuit design & simulation (LDO/OPA/ADC);
PVT simulation; assist layout & DRC/LVS;
Chip testing & debug;
Write design docs.
Majors: IC, Electronics, Microelectronics, EE. Knowledge of analog design flow & EDA tools (Cadence/Spectre).
Bachelor’s degree or above
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